Photonic Integration
Silicon photonics packaging, fiber array and on-board optics
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Photonic Integration
Photonic Integration
Silicon photonics packaging, fiber array and on-board optics
We deliver precision fiber arrays (single-mode, polarization-maintaining, lensed) with sub-micron pitch accuracy for silicon photonics die-to-fiber coupling.
Our integration team supports wafer-level test, hermetic packaging, and high-density electrical I/O design for next-generation co-packaged and near-package optics modules.
Prototype to production in 8–12 weeks for most standard configurations.
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